Panasonic Spg2 Screen Printer Nm-Ejp1b

Attack angle variable squeegee (option)

The set squeegee angle can be adjusted, using the front and rear squeegee vertical axes, between 45°and 70°.

Top/side clamper (movable type) (option)

Pressing down on PCB edge faces increases printing quality of warped PCB.
Either PCB upper or side face can be selected for correction.

New operation panel

1 A large-sized panel (15-inch) introduced to increase ease of use and visibility.
2 Screen configuration reviewed (a reduction in the number of screens) to decrease the screen handling time required.

Paper-less cleaning (option)

Mask cleaning without cleaning paper or solvent, eliminating paper and solvent exchange operations.

Holed pot type automatic solder supply (option)

Solder supply automated to promote labor saving and operation without interruption.

Support pin automatic exchange (option)

Automated collection/arrangement of support pins during changeover to save manpower.

According to the correction data of shifted printing positions analyzed by solder paste inspection (APC correction data), it corrects printing positions (X ,Y ,θ).
*3D inspection equipment of other companies can also be connected.

*Please inquire with your sales representative for more details.

By connecting with a host system (LNB,iLNB...) , the followings can be supported :

• Automatic changeover
• Material verification (solder/mask/squeegee...)
• Trace data output

• *1:The max PCB width changes when "Paper-less cleaning," "Support pin automatic exchange" or "Attack angle variable squeegee" has been selected.
  For details, see specifications.
• *2:PCB exchange time varies depending on the machine in the pre-process and the post process, the PCB size, the use of a PCB pressing-down unit and so forth.
• *3:For mask specifications, please see the specification.
• *4:Including blower and vacuum pump"Option"
• *5:Except for the signal tower and the touch panel.
• *6:With full options

*Values such as cycle time and accuracy may vary depending on operating conditions.
*Please refer to the "Specification booklet" for details.